Chemical mechanical planarization (CMP) post-cleaning

The present invention provides a cleaning composition comprising water; one or more organic acids; at least two surfactants wherein the first type of surfactant is a diphenyldisulfonic acid surfactant, the second type of surfactant has a surface tension of less than 50 dynes/cm at a concentration of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAMBOLI DHEERAJ, YOO JEONG-YOON, HWANG HEE-MIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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