Chemical mechanical planarization (CMP) post-cleaning
The present invention provides a cleaning composition comprising water; one or more organic acids; at least two surfactants wherein the first type of surfactant is a diphenyldisulfonic acid surfactant, the second type of surfactant has a surface tension of less than 50 dynes/cm at a concentration of...
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Format: | Patent |
Sprache: | chi ; eng |
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