Chemical mechanical planarization (CMP) post-cleaning

The present invention provides a cleaning composition comprising water; one or more organic acids; at least two surfactants wherein the first type of surfactant is a diphenyldisulfonic acid surfactant, the second type of surfactant has a surface tension of less than 50 dynes/cm at a concentration of 0.01 wt% in water, and the second type of surfactant is not the first type of surfactant; and optionally a fluorine-containing compound, a polymer, a corrosion inhibitor, a biological preservative, and a pH regulator. 本发明提供了一种清洁组合物，其包含水；一种或多种有机酸；至少两种表面活性剂，其中第一类型表面活性剂是二苯基二磺酸表面活性剂，第二类型表面活性剂在水中浓度为0.01重量％时具有小于50达因/cm的表面张力，并且第二类型表面活性剂不是第一类型表面活性剂；和任选地含氟化合物、聚合物、腐蚀抑制剂、生物防腐剂、pH调节剂。