Electromagnetic shielding method and electronic equipment

The invention discloses an electromagnetic shielding method and electronic equipment. The method comprises the steps that a chip is installed on a substrate with the front face facing downwards; covering a conductive layer on the back surface of the chip; a certain number of conductive leads are arranged on the periphery of the conductive layer in an overhanging mode. According to the invention, the conductive layer and the conductive leads around are directly utilized to form the shielding structure to shield the chip, so that the chip does not need to be shielded by slotting and filling after plastic packaging is completed, the process complexity and the cost of chip shielding are reduced, and the productivity is effectively improved. 本发明公开了一种电磁屏蔽方法及电子设备，该方法包括：将芯片正面向下安装于基板上；在所述芯片的背面上覆盖设置导电层；在所述导电层四周均悬垂设置一定数目的导电引线。在本发明中通过直接利用导电层与四周的导电引线形成屏蔽结构对芯片进行屏蔽，从而并不需要在塑封完成后开槽填充对芯片进行屏蔽，实现了降低芯片屏蔽的工艺复杂程度和成本，有效的提高产能。