Chip packaging method

The invention belongs to the technical field of semiconductor packaging, and particularly discloses a chip packaging method, which comprises the following steps of: 1) flip-chip welding a chip at a corresponding welding pad position on the front surface of a substrate to obtain a semi-finished product; 2) cleaning and drying the semi-finished product, and fixing the edge of the chip by using fixing glue; (3) assembling solder balls at the welding pads on the back surface of the semi-finished substrate processed in the step (2), and welding the solder balls on the welding pads of the substrate; 4) cleaning and drying the semi-finished product processed in the step 3), filling a gap between the chip and the substrate with underfill glue, and carrying out curing processing; and (5) mounting a heat dissipation cover on the semi-finished chip processed in the step (4) to finish chip packaging. According to the packaging method disclosed by the invention, the phenomena that the bottom filling of the chip is broken,