MULTILAYER ELECTRONIC COMPONENT

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a body including a dielectric layer and first and second internal electrode layers, with the dielectric layer interposed between the first and second internal electrode layers, and the bod...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM DONG-WOOK, SONG JUN-IL, KANG SUNG HYUNG, HYUN SUN-JOO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a body including a dielectric layer and first and second internal electrode layers, with the dielectric layer interposed between the first and second internal electrode layers, and the body having opposing first and second surfaces, opposing third and fourth surfaces, and opposing fifth and sixth surfaces; a first external electrode disposed on the third surface and connected to the first internal electrode layer; and a second external electrode disposed on the fourth surface and connected to the second internal electrode layer. The first inner electrode layer comprises a first inner electrode, a first step compensation part and a first middle electrode, and the first step compensation part is arranged to be separated from the two ends of the first inner electrode, the third surface and the fourth surface; the first intermediate electrode is disposed between the first inner electrode and the first s