Sensing element and pressure sensor

The invention relates to a sensing element and a pressure sensor, and the sensing element comprises a substrate which is provided with a first surface and a second surface which are opposite to each other in the thickness direction; the substrate is provided with at least one piezoresistor area, the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	XING KUNSHAN, WEN SAISAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL TECHNOLOGY NANOTECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a sensing element and a pressure sensor, and the sensing element comprises a substrate which is provided with a first surface and a second surface which are opposite to each other in the thickness direction; the substrate is provided with at least one piezoresistor area, the piezoresistor area is close to the first surface, the piezoresistor area is provided with a piezoresistor connecting area, and the piezoresistor connecting area is in electric contact with the at least two contact areas; the at least one protective layer covers the first surface of the substrate; the at least one first protection ring is located between the piezoresistor region and the second surface of the substrate; the at least one second protection ring is arranged in the substrate and is positioned between the protection layer and the first protection ring; the shielding layer is arranged on the surface of the protection layer or arranged between the protection layer and the piezoresistor area; at least one o