Rapid correction jig for electronic flame extinguishing height of semiconductor processing bonding wire

The invention discloses a semiconductor processing bonding wire electronic flame extinguishing height rapid correction jig, and relates to the technical field of semiconductor processing, the semiconductor processing bonding wire electronic flame extinguishing height rapid correction jig comprises a bottom plate, the upper side of the bottom plate is provided with a first connecting rod, and one side of the first connecting rod is fixedly connected with a plurality of supporting plates; a first cylinder and a second cylinder are fixedly connected to the upper side of the supporting plate, and a height adjusting mechanism is arranged on the upper side of the bottom plate; according to the electronic flame height correction device, the problems that due to the fact that electronic flame height correction of wire welding equipment is based on visual observation, deviation exists in the electronic flame extinguishing height of each piece of equipment, and therefore equipment ball burning is unstable and the consi