Packaging composition, packaging material, preparation method of packaging material and electronic device assembly

The invention relates to the field of preparation of electronic device components, and discloses a packaging composition, a packaging material, a preparation method of the packaging material and an electronic device component. The composition comprises a polymer matrix and an auxiliary agent, wherein the polymer matrix comprises hyperbranched polyethylene and an optional ethylene and alpha-olefin copolymer. And blending the polymer matrix and the auxiliary agent, standing at a constant temperature, carrying out melt extrusion to form a film, cooling and slitting to obtain the packaging material. According to the packaging composition provided by the invention, hyperbranched polyethylene with specific side chain types and quantity is added, so that the packaging composition has relatively high cross-linking speed during processing, and the curing time during preparation of a packaging adhesive film can be shortened, so that the production efficiency of preparing an electronic device assembly is improved, the e