Micro deep small hole machining method based on mechanical drilling-ultrafast laser combination

The invention discloses a micro deep small hole machining method based on mechanical drilling-ultrafast laser compounding, which comprises the following steps: establishing a data model of a workpiece and a quick-change tool with a datum point, and determining deep small hole machining coordinate va...

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Bibliographische Detailangaben
Hauptverfasser: GAO PING, GENG JUNRU, ZHANG ZHIHAO, ZHANG WENCAI, WANG QI, WEI YANG, LI XUAN, ZHANG CHAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a micro deep small hole machining method based on mechanical drilling-ultrafast laser compounding, which comprises the following steps: establishing a data model of a workpiece and a quick-change tool with a datum point, and determining deep small hole machining coordinate values of the workpiece; and according to the deep small hole machining coordinate value of the workpiece, a drilling center device is adopted for machining a deep small hole bottom hole, an ultrafast laser device is adopted for conducting deep hole repairing on the workpiece where the deep small hole bottom hole is machined, and finally the deep small hole is obtained through machining. According to the machining method, the machining method combining mechanical deep hole drilling bottom hole machining (rough machining) and ultrafast laser (femtosecond and picosecond) micro deep hole repairing (finish machining) is adopted, and the problems that according to the machining method in the prior art, the consistency of