Electronic device and vehicle
The invention provides an electronic device which comprises a circuit board (30) provided with a chip (31), the circuit board (30) is contained in a first cavity (1), meanwhile, the first cavity (1) is further filled with first heat conduction liquid (3), the circuit board (30) is immersed in the fi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an electronic device which comprises a circuit board (30) provided with a chip (31), the circuit board (30) is contained in a first cavity (1), meanwhile, the first cavity (1) is further filled with first heat conduction liquid (3), the circuit board (30) is immersed in the first heat conduction liquid (3), and heat of the circuit board (30) is easily taken away by the first heat conduction liquid (3). Therefore, compared with a mode of radiating by adhering a solid radiating material on the circuit board, the method has the advantages that the operation of aligning the solid radiating material with the chip and the like does not need to be executed, so that the assembly process is simple, the requirement on the assembly precision is low, the dislocation of the solid radiating material caused by the vibration of a vehicle is avoided, and the radiating effect is ensured.
本申请提供了一种电子装置,其包括设有芯片(31)的电路板(30),电路板(30)收纳在第一腔室(1)内,同时第一腔室(1)内还填充有第一导热液体(3),电路板(30)浸入第一导热液体(3),其热量被第一导热液体(3)容易地带走。如此,与 |
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