Periscopic camera module

The invention provides a periscopic camera module. The periscopic camera module comprises a light path turning element; the wafer-level lens is arranged at the emergent end of the light path turning element, the wafer-level lens is obtained by cutting a lens wafer, the lens wafer is an assembly form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUN XINXIANG, CHANG SHUHANG, MEI ZHEWEN, RONG QI, WANG QI, ZHENG CHENGCHANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a periscopic camera module. The periscopic camera module comprises a light path turning element; the wafer-level lens is arranged at the emergent end of the light path turning element, the wafer-level lens is obtained by cutting a lens wafer, the lens wafer is an assembly formed by assembling a plurality of lens wafers together, each lens wafer comprises a lens array formed by a plurality of lens units, and the lens units are arranged on the lens array. At least one surface of each lens unit is a light-transmitting curved surface, and the outer contour of the light-transmitting curved surface is circular; and the photosensitive component is used for receiving the optical signal passing through the wafer-level lens and outputting imaging data. According to the invention, the problem of inconsistent surface precision in two perpendicular directions caused by the forming process of the D-cut lens can be avoided, so that the imaging quality is ensured. The problems of astigmatism and the li