Chip package and manufacturing method thereof

The invention relates to a chip packaging piece and a manufacturing method thereof, the chip packaging piece comprises a substrate, a light-emitting chip fixedly arranged on a mounting surface of the substrate, at least one reinforcing piece and a packaging material, and the reinforcing piece is provided with a through hole penetrating through two sides of the reinforcing piece. The packaging material is laid on the mounting surface and wraps the light-emitting chip and the reinforcer, so that at least part of the packaging material is filled in the through hole and penetrates through the through hole, and the packaging material inside and outside the through hole is integrally cured and molded. Therefore, the reinforcing piece with the through hole is fixedly arranged on the mounting surface, the packaging material can be injected into the through hole during injection, and the packaging material inside and outside the through hole is solidified into a whole, so that an interlocking structure is formed betwe