System-in-package with flip-chip die over multi-layer heat spreader pillars

The present disclosure relates to a system-in-package with flip chip die over a multi-layer heat sink pillar, the system-in-package having a chiplet with a first substrate and a first die disposed over the first substrate, a second die, a second substrate on which the chiplet and the second die are disposed, and a heat sink diffuser disposed over the chiplet and the second die. Herein, the first substrate includes layered cake-shaped heat sink pillars coupled to the first die, and the second substrate includes layered cake-shaped heat sink pillars coupled to the chiplet and the second die. Thus, heat generated by the first die may be dissipated by the heat sink struts within the first and second substrates, and heat generated by the second die may be dissipated by the heat sink struts within the second substrate. In addition, heat generated by the first die and the second die may be dissipated by a heat sink diffuser over the dies. 本公开涉及一种具有在多层散热器支柱上方的倒装芯片管芯的系统级封装，系统级封装具有以下各项：具有第一基板和放置在第一基板上方的第一管芯的小芯片、第二管芯、小芯