Gas supply method for sputtering equipment

The invention relates to a gas supply method for sputtering equipment during coating, which adopts an annular gas supply channel (2), a group of gas holes (5) are uniformly distributed on the inner ring wall (4) of the annular gas supply channel, two gas supply pipes (3) connected with an external gas cylinder are symmetrically arranged at the upper end of the annular gas supply channel, and two groups of lifting ropes (1) are symmetrically arranged on the side wall of the annular gas supply channel. The annular air supply channel is fixed in the coating chamber through the lifting rope, and the annular air supply channel is fixed under the sample table or is located at the same horizontal position with a substrate material on the sample table, so that a group of air holes are uniformly distributed in the inner annular wall to fully cover the whole sample table. According to a conventional reactive sputtering or doping sputtering process, corresponding gas flow, pressure and temperature are set, and a group o