Semiconductor device
A semiconductor device (100) according to the present disclosure is provided with a semiconductor chip (130) in which are formed a protruding terminal (14) that is electrically connected to a transistor (13) and has a larger cross-sectional area than a bonding wire (4), and an insulating short-circu...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A semiconductor device (100) according to the present disclosure is provided with a semiconductor chip (130) in which are formed a protruding terminal (14) that is electrically connected to a transistor (13) and has a larger cross-sectional area than a bonding wire (4), and an insulating short-circuit prevention side wall (15) that covers a side surface facing the periphery of the protruding terminal (14). The semiconductor chip (130) is bonded to the upper surface (3) of the metal plate (2) by a conductive bonding material (6). A conductor pattern (34a) formed on a circuit board (30) bonded to the upper surface (3) of the metal plate (2) and an end portion of the protruding terminal (14) in the protruding direction are connected by a bonding wire (4).
本公开所涉及的半导体装置(100)具备半导体芯片(130),半导体芯片(130)形成有与晶体管(13)导通并具有比接合线(4)大的截面积的突起状端子(14)以及覆盖朝向其周围的侧面的具有绝缘性的防短路用侧壁(15)。半导体芯片(130)通过具有导电性的接合材料(6)接合于金属板(2)的上表面(3)。形成于与金属板(2)的上表面(3)接合的电路基板(30)的导体图案(34a)和突起状端子(14)的突出方向的端部通过接合线(4)连接。 |
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