Resist peeling method, resist peeling apparatus, and pretreatment method

Provided is a peeling method capable of peeling a resist while sufficiently considering the burden on the environment and suppressing the processing time and cost required for peeling. A resist peeling method for peeling a resist formed on a substrate includes: a pretreatment step of exposing the re...

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Bibliographische Detailangaben
Hauptverfasser: FUNAKOSHI TAKAO, SAKAI TAKESHI, SHIRAI YASUYUKI, FUJIMOTO HISASHI, JIAIMARU TAKAYUKI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Provided is a peeling method capable of peeling a resist while sufficiently considering the burden on the environment and suppressing the processing time and cost required for peeling. A resist peeling method for peeling a resist formed on a substrate includes: a pretreatment step of exposing the resist to heated steam in a predetermined temperature range for a predetermined time; and a peeling treatment step in which the resist exposed to the heated vapor in the pretreatment step is subjected to a peeling treatment using a resist peeling liquid, the predetermined temperature range and the predetermined time being set on the basis of the resist. 提供一种能够在充分地考虑对环境的负担并且抑制剥离所需要的处理时间和成本的同时对抗蚀剂进行剥离的剥离方法。用于剥离在基板上成膜的抗蚀剂的抗蚀剂剥离方法包括:预处理工序,使抗蚀剂在规定温度范围的加热蒸气中暴露规定时间;以及剥离处理工序,使用抗蚀剂剥离液对在预处理工序中暴露于加热蒸气的抗蚀剂进行剥离处理,其中,规定温度范围和规定时间是基于抗蚀剂来进行设定的。