Resin composition

The invention provides a resin composition which comprises resin and inorganic filler. The resin comprises polycyanate resin and bismaleimide resin, and the purity of the inorganic filler is at least greater than 99%. 本发明提供一种树脂组成物，包括树脂以及无机填充物。树脂包括聚氰酸酯树脂与双马来酰亚胺树脂，且无机填充物的纯度至少大于99％。...

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Bibliographische Detailangaben
Hauptverfasser:	WEI QIANKAI, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention provides a resin composition which comprises resin and inorganic filler. The resin comprises polycyanate resin and bismaleimide resin, and the purity of the inorganic filler is at least greater than 99%. 本发明提供一种树脂组成物，包括树脂以及无机填充物。树脂包括聚氰酸酯树脂与双马来酰亚胺树脂，且无机填充物的纯度至少大于99％。