Planet wheel and device for double-sided grinding of gallium nitride wafer
The invention discloses a planet wheel for double-sided grinding of gallium nitride wafers, the planet wheel comprises a planet wheel body, the planet wheel body is made of a hard material, the planet wheel body is provided with a plurality of through holes for placing the gallium nitride wafers, an...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a planet wheel for double-sided grinding of gallium nitride wafers, the planet wheel comprises a planet wheel body, the planet wheel body is made of a hard material, the planet wheel body is provided with a plurality of through holes for placing the gallium nitride wafers, and the hole wall of each through hole is provided with a flexible layer. Compared with the prior art, the flexible layer is arranged on the hole wall of the through hole of the planet wheel, hard contact between the planet wheel and the wafer is changed into flexible contact, the problem of edge corner chipping of the gallium nitride wafer during grinding machining can be effectively solved, the overall yield is improved, and the wafer grinding efficiency and grinding uniformity can be improved.
本发明公开了一种用于氮化镓晶片双面研磨的行星轮,该行星轮包括行星轮本体,所述行星轮本体为硬质材料,所述行星轮本体设有若干个用于放置氮化镓晶片的通孔,各所述通孔的孔壁具有一层柔性层。与现有技术相比,本发明通过在行星轮通孔孔壁设置柔性层,将行星轮与晶片的硬性接触变为柔性接触,不仅能有效解决研磨加工时氮化镓晶片边缘崩角的问题,提高整体良率,还能提高晶片研磨效率和研磨的均一性。 |
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