Rapid annealing equipment for semiconductor wafer and use method of rapid annealing equipment

The invention discloses rapid annealing equipment for a semiconductor wafer and a using method of the rapid annealing equipment, and belongs to the technical field of semiconductor wafer manufacturing and processing.The rapid annealing equipment comprises an annealing furnace unit, a furnace core body, a furnace cover and a heating assembly, and the peripheral side of the top of the furnace bottom is fixedly connected with the bottom of a circular furnace body through an outer fixing edge; a furnace opening is formed in the middle of the front side of the round furnace body, a furnace opening plugging and sealing unit corresponding to the furnace opening is installed on the outer side of the round furnace body, the inner side of the round furnace body is sleeved with a heat preservation and insulation sleeve, the inner side of the heat preservation and insulation sleeve is sleeved with a heat storage iron sleeve, and the center of the top of the furnace bottom is fixedly connected with the bottom of a furnace