Wafer cleaning method

The invention discloses a wafer cleaning method, which comprises the following steps of: checking the horizontal positions of a driving wheel and a driven wheel, and adjusting the driving wheel and/or the driven wheel according to requirements, so that the driving wheel and the driven wheel are posi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU XINCHUN, SUI YINGZHAO, THE INVENTOR HAS WAIVED THE RIGHT TO BE MENTIONED, ZHAO DEWEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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