Wafer cleaning method

The invention discloses a wafer cleaning method, which comprises the following steps of: checking the horizontal positions of a driving wheel and a driven wheel, and adjusting the driving wheel and/or the driven wheel according to requirements, so that the driving wheel and the driven wheel are positioned in the same plane; placing a wafer on a supporting device formed by a driving wheel and a driven wheel; and the cleaning brushes on the two sides of the wafer move to the cleaning position so as to carry out rolling brush cleaning on the front and back surfaces of the wafer. 本发明公开了一种晶圆清洗方法，其包括：校核主动轮和从动轮的水平位置，并视需调整主动轮和/或从动轮，使得主动轮和从动轮位于同一平面中；将晶圆放置于主动轮和从动轮形成的支撑装置；位于晶圆两侧的清洗刷移动至清洗位置，以对晶圆的正反两面进行滚刷清洗。