Wedge-shaped bonding structure and use method

The invention relates to the technical field of microelectronic packaging, and particularly discloses a wedge-shaped bonding structure and a use method, and the wedge-shaped bonding structure is used for bonding a bonding wire; comprising a chopper and a wire clamp used in cooperation with the chopper. The wire clamp comprises a clamping part and a body connected with the clamping part; the body is provided with a lead through hole and a lead limiting groove which is communicated with the lead through hole and is close to one side of the chopper; the invention also discloses a use method thereof. Compared with a chopper structure in the prior art, the chopper structure is simplified, and the processing difficulty and cost of the chopper are reduced; when the chopper is used and scrapped, the wire clamp can be used for a long time only by replacing the chopper; the structure is simple and practicability is high. 本发明涉及微电子封装技术领域，具体公开了一种楔形键合结构及使用方法，其中楔形键合结构，用于键合引线键合；包括劈刀、与劈刀配合使用的线夹；在所述线夹包括夹持部、与夹持部连接的本体；在所述本体上设置有引