Transmission electron microscope in-situ thermal parameter test chip and preparation method thereof

The invention discloses a transmission electron microscope in-situ thermal parameter test chip and a preparation method thereof, the chip is an MEMS device, and two suspended platforms in bilateral symmetry are formed on a silicon substrate; each suspended platform structure comprises a bottom-layer...

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Bibliographische Detailangaben
Hauptverfasser: NIE MENG, YIN KUIBO, JIN ZHANRUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a transmission electron microscope in-situ thermal parameter test chip and a preparation method thereof, the chip is an MEMS device, and two suspended platforms in bilateral symmetry are formed on a silicon substrate; each suspended platform structure comprises a bottom-layer electric heating insulation protection layer, a resistor, a metal electrode and a metal heat reflecting mirror are sequentially arranged on the bottom-layer electric heating insulation protection layer at intervals, the metal heat reflecting mirrors are located on the opposite inner sides of the two suspended platforms, and the resistor is covered with a top-layer electric heating insulation protection layer. The upper layer and the lower layer of the resistor structure are respectively provided with an electric heating insulation protection layer, so that the electric heating insulation protection layers are isolated from the outside, and the influence of the external environment on electrical signals of the temp