Method for acquiring surface morphology of wafer

The invention provides a method for acquiring the surface topography of a wafer. The method comprises the following steps: acquiring at least three interference fringe patterns of the wafer; dividing the wafer to obtain a plurality of partitions on the wafer; processing the at least three interference fringe patterns to obtain the vibration phase shift amount of each subarea, and obtaining the phase distribution diagram of each subarea according to the vibration phase shift amount; splicing the phase distribution diagrams of the partitions to obtain a phase distribution diagram of the wafer; and converting the phase distribution diagram of the wafer into a height distribution diagram for describing the surface topography. According to the invention, the influence of environmental vibration on the precision of the morphology measurement result of the wafer surface can be reduced. 本发明提供了一种晶圆的表面形貌的获取方法，包括：采集晶圆的至少三幅干涉条纹图；对所述晶圆进行划分，以获取所述晶圆上的多个分区；对至少三幅所述干涉条纹图进行处理，以分别获取每一个分区的振动相移量，并根据所述振动相移量获取每一个分区的相位分布图；将各分区的所述相位分布