Chip package and electronic equipment

The embodiment of the invention provides a chip package and electronic equipment, relates to the technical field of electronics, and can solve the heat dissipation problem of a light and thin chip under a small package size. The chip includes: a substrate; the silicon wafer is arranged on one side of the substrate; the heat dissipation cover is connected with the substrate, the heat dissipation cover and the silicon wafer are arranged on the same side of the substrate, an opening is formed in the heat dissipation cover in the thickness direction of the substrate, the silicon wafer is arranged in the opening, the heat dissipation cover at least partially surrounds the silicon wafer, and the height of the silicon wafer is smaller than or equal to that of the heat dissipation cover. According to the chip package provided by the embodiment of the invention, most heat generated by the silicon wafer is dissipated from the periphery through the heat dissipation cover surrounding the silicon wafer. 本申请实施例提供一种芯片封装和电子设