SUBSTRATE PROCESSING APPARATUS, TEMPERATURE CONTROL PROGRAM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND TEMPERATURE CONTROL METHOD

The present invention is configured so as to have a cooling control unit that acquires information on the temperature of a heating unit and/or the temperature of a processing chamber, the degree of opening of a cooling valve, and an exhaust fan; the opening degree of the cooling valve is adjusted such that the error between a predicted temperature sequence calculated in accordance with the prediction model and a target temperature sequence calculated using the ratio of the change from the current target temperature to the final target temperature is minimized. 构成为具有冷却控制部，该冷却控制部分别获取加热部的温度、以及处理室的温度中的至少某一个温度、冷却阀的开度、排气扇的信息，以使按照预测模型算出的预测温度列与利用在从当前的目标温度变化至最终目标温度时的变化的比率算出的目标温度列之间的误差成为最小的方式对冷却阀的开度进行调节。