Method for preparing LED device based on surface mounting

The embodiment of the invention discloses a method for preparing an LED device based on surface mounting, and relates to the LED packaging technology, and the method comprises the steps: preparing a fluorescent sheet of the LED device, and enabling the four corners of the fluorescent sheet to be pro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI HONGHAO, KUANG XIANFENG, WU XIAOTING, WANG TIEZHU, LAN MINGWEN, LI BOJIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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