Method for preparing LED device based on surface mounting

The embodiment of the invention discloses a method for preparing an LED device based on surface mounting, and relates to the LED packaging technology, and the method comprises the steps: preparing a fluorescent sheet of the LED device, and enabling the four corners of the fluorescent sheet to be provided with arc-shaped structures; transferring the fluorescent sheets to a carrier according to the arrangement mode of the chips on the circuit board, wherein the carrier is provided with a low-viscosity adhesive layer for bonding the fluorescent sheets; sleeving a mask plate on the circuit board after die bonding and wire bonding; spraying an adhesive on the surface of the chip on the circuit board based on the sleeved mask plate; the mask plate is removed, and the fluorescent sheet on the bearing object and the circuit board sprayed with the adhesive are aligned and attached; curing the fluorescent sheet on the carrier and the chip on the circuit board, and removing the carrier during curing; carrying out white