Semiconductor package

A semiconductor device includes: a substrate including an upper protective layer and a plurality of upper bonding pads; a semiconductor chip on the substrate; and a plurality of bonding wires connected to the semiconductor chip and the upper bonding pad. Each upper bonding pad includes: a first conductive pattern; a second conductive pattern covering a top surface and sidewalls of the first conductive pattern and including a same metal element as a metal element of the first conductive pattern; and a bonding layer on the second conductive pattern. A width at a top surface of the first conductive pattern is less than a width at a bottom surface of the first conductive pattern. The upper protection layer covers the side wall of the second conductive pattern. 一种半导体器件包括：衬底，包括上保护层和多个上接合焊盘；衬底上的半导体芯片；以及多个接合线，连接到半导体芯片和上接合焊盘。每一个上接合焊盘包括：第一导电图案；第二导电图案，覆盖第一导电图案的顶表面和侧壁，并且包括与第一导电图案的金属元素相同的金属元素；以及第二导电图案上的接合层。第一导电图案的顶表面处的宽度小于第一导电图案的底表面处的宽度。上保护层覆盖第二导电图案的侧壁。