Wet etching device and wet etching control method

The invention provides a wet etching device and a wet etching control method, and belongs to the technical field of photoelectron manufacturing. The wet etching device comprises an etching tank, a hydrogen ion concentration detector, a first pipeline, a first electric control valve and a controller, the hydrogen ion concentration detector is located in the etching tank, one end of the first pipeline is communicated with the etching tank, the first electric control valve is connected to the first pipeline, and the first pipeline is used for conveying acid liquor into the etching tank; the controller is electrically connected with the hydrogen ion concentration detector and the first electric control valve, and the controller is configured to control the first electric control valve to be switched on when the hydrogen ion concentration detected by the hydrogen ion concentration detector is lower than a preset threshold value. According to the invention, the corrosion speed in the wet etching process can be kept