METHOD OF IMAGING AND MILLING A SAMPLE

The invention relates to a method for grinding and imaging a sample. The method includes the steps of providing an imaging system and abrading a beam source. The method comprises the steps of: abrading a sample using an abrasive beam from the abrasive beam source to remove layers of the sample; and imaging the exposed surface of the sample using the imaging system. As defined herein, the method further includes the steps of determining a relative position of the sample, and using the determined relative position of the sample in the grinding step for positioning the sample relative to the grinding beam. The relative position of the sample may be a working distance relative to the imaging system, which may be determined by means of an autofocus procedure. 本发明涉及对样本进行研磨和成像的方法。所述方法包括提供成像系统以及研磨束源的步骤。所述方法包括以下步骤：使用来自所述研磨束源的研磨束研磨样本以去除样本的层；以及使用所述成像系统对样本的暴露表面进行成像。如本文所限定的，所述方法进一步包括如下步骤：确定所述样本的相对位置，并且在所述研磨步骤中使用所述样本的所述确定的相对位置以用于相对于所述研磨束定位所述样本。所述样本的相对位置可以是相对于成像系统的工作距离，这可以借助于自动聚焦程序来确定。