Method for phosphorizing abrasive grains, Ni2P-containing abrasive grains and cutting wire containing said abrasive grains

The invention provides a method for phosphorizing abrasive particles, the abrasive particles containing Ni2P and a cutting line containing the abrasive particles. The method for phosphorizing the abrasive particles comprises the following steps: forming at least one metal layer containing nickel and...

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Bibliographische Detailangaben
Hauptverfasser: WEI ZIJIAN, LUO HUIHONG, HUANG SONGXIU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a method for phosphorizing abrasive particles, the abrasive particles containing Ni2P and a cutting line containing the abrasive particles. The method for phosphorizing the abrasive particles comprises the following steps: forming at least one metal layer containing nickel and phosphorus on the surface of the abrasive particles, and then carrying out phosphorizing reaction, so as to form a phosphate-rich layer with excellent corrosion resistance on the surface of the at least one metal layer containing nickel and phosphorus. 本发明提供一种磷化磨粒的方法、含Ni2P的磨粒及含前述磨粒的切割线。所述磷化磨粒的方法包括在磨粒的表面形成至少一含镍磷的金属层,然后进行磷化反应,以在所述至少一含镍磷的金属层的表面形成具有优异的抗腐蚀性的富磷化层。