Double-sided grinding method for multi-layer copper material

The invention discloses a double-sided grinding method for a multi-layer copper material, which comprises the following steps of: simultaneously and sequentially grinding the multi-layer copper material by using an upper grinding disc and a lower grinding disc, according to the double-sided grinding method, the characteristics of the grinding disc are changed by optimizing the formula of the grinding disc, resin agglomerated particles in the grinding disc are eliminated, deep scratches caused by workpiece grinding are avoided, and the grinding efficiency can be further improved. And in cooperation with optimized multi-section grinding parameters, the problems of poor surface roughness, corner burrs, edge collapse, deep scratches and the like of the copper material are effectively avoided. 本发明公开了一种多层铜质材料的双面研磨方法，研磨方法包括以下步骤：利用上研磨盘以及下研磨盘同时对所述多层铜质材料依次进行研磨处理，所述研磨处理包括第一次双面研磨，第二次双面研磨、第三次双面研磨以及第四次双面研磨，上述双面研磨方法通过优化磨盘本身配方改变磨盘自身特性，消除磨盘内部树脂团聚颗粒，以达到避免工件研磨深划痕出现，还可以进一步提高研磨效率。配合优化的多段研磨参数，有效避免铜质材料表面粗糙度不良、边角毛刺、塌边以及深划痕等问题。