Bonding welding method and judgment method

The invention discloses a bonding welding method and a judging method, and the bonding welding method comprises the following steps: S1, placing a to-be-processed substrate on a workbench, limiting the X direction and the Y direction of the to-be-processed substrate, welding a first area, covered by...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WU XING, TANG JIANWEI, WU QIANHAO, CHEN PENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a bonding welding method and a judging method, and the bonding welding method comprises the following steps: S1, placing a to-be-processed substrate on a workbench, limiting the X direction and the Y direction of the to-be-processed substrate, welding a first area, covered by a welding range of bonding welding equipment, on the to-be-processed substrate through the bonding welding equipment; s2, the base plate is rotated by 90 degrees in the first direction, the X direction and the Y direction of the base plate to be machined are limited, and a second area is welded; s3, the base plate is rotated by 90 degrees in the first direction, the X direction and the Y direction of the base plate to be machined are limited, and a third area is welded; and S4, the base plate is rotated by 90 degrees in the first direction, the X direction and the Y direction of the base plate to be machined are limited, and the fourth area is welded. According to the method, the accuracy of the welding position o