Bonding strap assembly crimping forming tool and process method
The invention discloses a bonding wire assembly crimping forming tool and a process method, the tool comprises a lower die and a baffle plate, and the top plane of the lower die is provided with a semicircular cavity for placing bonding grid lines; the baffle is fixed to the top plane of the lower d...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a bonding wire assembly crimping forming tool and a process method, the tool comprises a lower die and a baffle plate, and the top plane of the lower die is provided with a semicircular cavity for placing bonding grid lines; the baffle is fixed to the top plane of the lower die through screws and located on one side of the semicircular cavity. The bonding grid line is stably placed in the semicircular cavity of the lower die, the baffle can prevent the lug plate from deviating in the crimping process, the working efficiency can be improved, and the product quality can be improved.
本发明公开了一种搭铁线组件压接成型工装及工艺方法,其中工装包括下模和挡板,下模顶平面上具有放置搭铁网格线的半圆形型腔;挡板通过螺钉固定在下模顶平面上且位于半圆形型腔一侧。本发明搭铁网格线稳固的放置在下模的半圆形型腔内,挡板能够防止接线片在压接时的偏移,能够提高工作效率,提升产品质量。 |
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