Flexible intelligent patch and method for in-situ monitoring of wound bacteria
The invention discloses a flexible intelligent patch and method for in-situ monitoring of wound bacteria. The patch comprises a packaging adhesion layer, a control circuit, an electrode array and a wound exudate absorption layer. The control circuit and the electrode array are electrically connected...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a flexible intelligent patch and method for in-situ monitoring of wound bacteria. The patch comprises a packaging adhesion layer, a control circuit, an electrode array and a wound exudate absorption layer. The control circuit and the electrode array are electrically connected through the electrode array connection bonding pad to form a combined plane structure which is jointly embedded in the packaging adhesion layer. And the wound exudate absorbing layer is fixed on the lower surface of the electrode array package. The electrode array comprises a staphylococcus aureus transpeptidase sensing electrode and a pyocyanine sensing electrode. Wireless power supply and data interaction are carried out through the mobile terminal by utilizing the near-field communication module, and in-situ real-time measurement is carried out on wound exudate by adopting an electrochemical analysis means, so that simultaneous monitoring of infection conditions of staphylococcus aureus and pseudomonas aerugino |
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