Film peeling device, and layering apparatus and semiconductor manufacturing apparatus provided with same

Embodiments of the present invention provide a film peeling apparatus capable of peeling a film from a wafer, a layering apparatus including the same, and a semiconductor manufacturing apparatus. The film peeling apparatus according to the present invention comprises: a chuck on which a wafer on which a film is attached is placed; a peeling roller that makes a tape for peeling the film from the wafer contact the film; and a stripping bar (Bar) for adjusting the stripping angle between the film to which the adhesive tape is attached and the wafer. 本发明的实施例提供能够从晶圆剥离膜的膜剥离装置及具备其的分层设备以及半导体制造设备。根据本发明的膜剥离装置包括：卡盘，被安放上方附着有膜的晶圆；剥离辊，使得用于将所述膜从所述晶圆剥离的胶带接触于所述膜；以及剥离杆(Bar)，调节附着有所述胶带的所述膜和所述晶圆之间的剥离角度。