Photodetector, solid-state imaging element, and method for manufacturing photodetector
A photodetector (10) is provided with: a semiconductor substrate (100); a photoelectric conversion unit (101) provided on the semiconductor substrate (100); and a light-condensing unit (300) which faces the photoelectric conversion unit (101) and has light transmissivity. The light-collecting sectio...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A photodetector (10) is provided with: a semiconductor substrate (100); a photoelectric conversion unit (101) provided on the semiconductor substrate (100); and a light-condensing unit (300) which faces the photoelectric conversion unit (101) and has light transmissivity. The light-collecting section (300) has an inorganic material layer (301) and an inorganic material layer (302) having a refractive index lower than that of the inorganic material layer (301), the inorganic material layer (301) is disposed such that at least a portion thereof overlaps the photoelectric conversion section (101) in plan view, and the inorganic material layer (302) is disposed so as to cover the inorganic material layer (301).
光检测器(10)具备半导体基板(100)、光电转换部(101),被设置在半导体基板(100);以及聚光部(300),与光电转换部(101)相对,且具有透光性。聚光部(300)具有无机材料层(301)和折射率比无机材料层(301)的折射率低的无机材料层(302),在平面图中无机材料层(301)被配置为至少一部分与光电转换部(101)重叠,无机材料层(302)被配置为覆盖无机材料层(301)。 |
---|