Compositions and methods of use thereof
The present disclosure relates to a composition comprising at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low k removal rate inhibitor; and an aqueous solvent. 本公开有关于一种组成物，其包括至少一种第一钌去除率增强剂；至少一种铜去除率抑制剂；至少一种低k去除率抑制剂；及一水性溶剂。...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present disclosure relates to a composition comprising at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low k removal rate inhibitor; and an aqueous solvent.
本公开有关于一种组成物，其包括至少一种第一钌去除率增强剂；至少一种铜去除率抑制剂；至少一种低k去除率抑制剂；及一水性溶剂。 |
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