Flexible heating element, method for producing such heating element and use of flexible heating element

The invention relates to a flexible heating element (10) exhibiting a temperature resistance of at least 250 DEG C, in particular at least 300 DEG C, comprising:-an electrically conductive substrate (15) formed from a metal foil; an insulating layer (20) formed on at least one side surface (16) of t...

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Bibliographische Detailangaben
Hauptverfasser: ASMUS TOM, MUZIOL MATTHIAS, WINAND KRISTIN, NIEMANN CHRISTIAN, NICK CHRISTOPH, DITTMANN STEFAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a flexible heating element (10) exhibiting a temperature resistance of at least 250 DEG C, in particular at least 300 DEG C, comprising:-an electrically conductive substrate (15) formed from a metal foil; an insulating layer (20) formed on at least one side surface (16) of the substrate (15); and-a heating structure (30) formed on a side (21) of the insulating layer (20) facing away from the substrate (15), in which the heating element (10) has a heating element thickness (DH) of less than 1.0 mm, the substrate (15) has a substrate thickness (DS) of 0.02 mm to 0.5 mm, and the insulating layer (20) has an insulating layer thickness (DI) of 0.2 [mu] m to 30 [mu] m. 本发明涉及一种表现出至少250℃、特别是至少300℃的耐温性的柔性加热元件(10),包括:-导电基板(15),该导电基板由金属箔形成;-绝缘层(20),该绝缘层形成在该基板(15)的至少一个侧面(16)上;和-加热结构(30),该加热结构形成在该绝缘层(20)的背对该基板(15)的侧面(21)上,其中该加热元件(10)具有小于1.0mm的加热元件厚度(DH),该基板(15)具有0.02mm至0.5mm的基板厚度(DS),并且该绝缘层(20)具有0.2μm至30μm的绝缘层厚度(DI)。