Insulation and through-flow joint simulation optimization method for high-voltage switch

The invention belongs to the field of high-voltage switch equipment design, and particularly relates to a high-voltage switch insulation and through-flow joint simulation optimization method, which comprises the following steps of: firstly, determining the inner diameter of a cylinder and the outer...

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Bibliographische Detailangaben
Hauptverfasser: LI MIAOXIN, WANG ZHIJUN, TAN SHENGWU, ZHANG BO, ZHONG JIANYING, ZHANG HAO, LIU YAPEI, YAO YONGQI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the field of high-voltage switch equipment design, and particularly relates to a high-voltage switch insulation and through-flow joint simulation optimization method, which comprises the following steps of: firstly, determining the inner diameter of a cylinder and the outer diameter of a central conductor as coupling parameters, and establishing geometric parameter models of a basin-type insulator, a three-post insulator, the cylinder and the central conductor; all the models are coupled to establish a bus parameterized insulation and through-flow joint simulation model, material parameters needed by insulation and through-flow calculation are applied to the bus parameterized insulation and through-flow joint simulation model, insulation and through-flow calculation boundary conditions are set, electric field distribution of insulators and temperature rise distribution of a cylinder and a center conductor are calculated and solved, and the insulation and through-flow joint simulation