Insulation and through-flow joint simulation optimization method for high-voltage switch
The invention belongs to the field of high-voltage switch equipment design, and particularly relates to a high-voltage switch insulation and through-flow joint simulation optimization method, which comprises the following steps of: firstly, determining the inner diameter of a cylinder and the outer...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention belongs to the field of high-voltage switch equipment design, and particularly relates to a high-voltage switch insulation and through-flow joint simulation optimization method, which comprises the following steps of: firstly, determining the inner diameter of a cylinder and the outer diameter of a central conductor as coupling parameters, and establishing geometric parameter models of a basin-type insulator, a three-post insulator, the cylinder and the central conductor; all the models are coupled to establish a bus parameterized insulation and through-flow joint simulation model, material parameters needed by insulation and through-flow calculation are applied to the bus parameterized insulation and through-flow joint simulation model, insulation and through-flow calculation boundary conditions are set, electric field distribution of insulators and temperature rise distribution of a cylinder and a center conductor are calculated and solved, and the insulation and through-flow joint simulation |
---|