Thermally conductive adhesive

The present invention relates to a hot melt adhesive having improved thermal conductivity, the use thereof and a method for preparing an article having improved thermal conductivity using said adhesive composition. The adhesive compositions of the present invention comprise a combination of at least...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BUTTERBACH RUDIGER, COPANIA SERGIO, MARKIEFKA PATRICK, SCHUBERT CHRISTIAN, SIPPENKOTTEN JOOST
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a hot melt adhesive having improved thermal conductivity, the use thereof and a method for preparing an article having improved thermal conductivity using said adhesive composition. The adhesive compositions of the present invention comprise a combination of at least one (co) polymer adhesive and different fillers as defined herein. 本发明涉及具有改进的导热性的热熔粘合剂、其用途和使用所述粘合剂组合物制备具有改进的导热性的制品的方法。本发明的粘合剂组合物包含至少一种(共)聚合物粘合剂和如本文定义的不同填料的组合。