FILM FOR MANUFACTURING ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

The present disclosure provides a film for manufacturing an electronic component and a method for manufacturing an electronic component. The film for manufacturing an electronic component includes: a polymer layer; and a metal nanowire dispersed in the polymer layer. The polymer layer may include a...

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Bibliographische Detailangaben
Hauptverfasser:	LEE EUN JUNG, LEE JONG-HO, PARK JUNG-JIN, PARK JEONG-JIN, SHEN DAZHEN, KIM SOO-MIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present disclosure provides a film for manufacturing an electronic component and a method for manufacturing an electronic component. The film for manufacturing an electronic component includes: a polymer layer; and a metal nanowire dispersed in the polymer layer. The polymer layer may include a polyester-based compound, such as polyethylene terephthalate. The metal nanowires may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof. 本公开提供一种用于制造电子组件的膜以及用于制造电子组件的方法。所述用于制造电子组件的膜包括：聚合物层；以及金属纳米线，分散在所述聚合物层中。所述聚合物层可包括诸如聚对苯二甲酸乙二醇酯的聚酯类化合物。所述金属纳米线可包括诸如镍(Ni)、钴(Co)、铁(Fe)和它们的合金中的至少一种的铁磁金属。