Method for manufacturing multilayer circuit board including ultramicro through hole and multilayer circuit board

The invention discloses a manufacturing method of a multilayer circuit board including ultra-micro through holes and the multilayer circuit board. The manufacturing method may comprise: a step of providing a substrate in which an upper conductive layer is formed on at least a portion of one surface and a lower conductive layer is formed on at least a portion of the other surface; forming a lower metal layer on the other surface of the substrate; forming a first barrier layer on one surface of the substrate through a photoetching process, and forming a first opening in the first barrier layer; a step of forming a metal pillar by plating the first opening by an electrolytic plating method; a step of removing the first barrier layer; forming an insulating layer at the position where the first barrier layer is removed; and grinding the metal column and the insulating layer to be flat. 根据本公开的一实施例的包括超微通孔的多层电路板的制造方法以及该多层电路板。制造方法可以包括：提供在一面的至少一部分形成上部导电层，在另一面的至少一部分形成下部导电层的基板的步骤；在基板的另一面形成下部金属层的步骤；通过光刻工艺在所述基板的一面形成第一阻挡层，在