SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The present invention realizes a semiconductor device in which formation defects of a coating material covering a semiconductor chip are suppressed. This semiconductor device is provided with: an insulating circuit board having a conductive pattern layer; a sintered member disposed on the conductive pattern layer; a semiconductor chip disposed on the sintered member; and a coating member covering the semiconductor chip. The sintered member has a recessed portion and a frame portion constituting an outer edge of the recessed portion on a surface opposite to the conductive pattern layer. The semiconductor chip is mounted in the recess, and is disposed such that the upper surface is positioned closer to the conductive pattern layer than the upper end of the frame. As a result, the frame portion of the sintered member functions as a dam portion on the semiconductor chip in which the coating material is left on the inside thereof, and the semiconductor chip is prevented from being exposed from the coating material