Lead bonding process applied to integrated circuit packaging

The invention relates to a lead bonding process applied to integrated circuit packaging. The lead bonding process comprises the following steps: providing a lead bonding assembly; moving the lead bonding assembly to enable the solder balls to be in contact with the to-be-bonded chip; loading a first output mode to the lead bonding assembly, and performing preliminary welding based on the contact position of the solder ball and forming a first solder joint; and loading a second output mode on the lead bonding assembly so as to further improve the welding strength of the welding ball and the chip. According to the lead bonding assembly, the first output mode with relatively low power is used, so that the welding balls at the front ends of the leads are preliminarily welded with the chips, and the chips are prevented from being damaged in the welding process. After the preliminary welding is completed, the second output mode is adopted, welding is carried out based on the welding surface formed by the preliminar