Welding method for semiconductor aluminum alloy cavity
The invention discloses a welding method for a semiconductor aluminum alloy cavity. The welding method comprises the following steps that S1, a to-be-welded product is subjected to chemical cleaning in a clean room; s2, pure water is used for conducting secondary flushing on the cleaned to-be-welded...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a welding method for a semiconductor aluminum alloy cavity. The welding method comprises the following steps that S1, a to-be-welded product is subjected to chemical cleaning in a clean room; s2, pure water is used for conducting secondary flushing on the cleaned to-be-welded product, and vacuum packaging is conducted after air flow blow-drying; s3, a water path, a circuit and a gas path in the welding device are connected, set parameters are adjusted, and the vacuum-packaged to-be-welded product is unsealed; and S4, the welding device comprises a switch, after the to-be-welded product is unsealed, the switch is connected, then welding is conducted, energizing gas is inflated, and welding wire filling is continuously conducted in the welding process. The preheating step of the welded product is omitted, so that the preparation operation of the to-be-welded product before welding is reduced, the production efficiency is improved, the problems that the preheating temperature of the to-be |
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