Soldering device, in particular reflow soldering device, having drawer in cooling zone

Disclosed is a soldering device (10), in particular a reflow soldering device, for continuously soldering printed circuit boards in a transport direction (18), comprising a process channel (16) comprising a pre-heating zone (20), a soldering zone (22) and a cooling zone (24), comprising a base body (60) and a cover (25) which can be displaced between a closed position in which the base body (60) and the cover (25) are separated from each other, and an open position in which the cover (25) and the base body (60) are separated from each other by means of the pre-heating zone (20), the soldering zone (22) and the cooling zone (24). The invention relates to a spray nozzle (100), in particular a spray nozzle, comprising a base body in which a nozzle plate (118), a fan unit (100) having a fan motor (102), an air duct (114, 122) conducting a process gas, a filter element (142) and/or a cooling element are arranged, characterized in that a drawer is arranged in the base body, which drawer extends in a pull-out direct