Soldering device, in particular reflow soldering device, having fan unit arranged laterally next to process channel

The invention relates to a soldering device (10), in particular a reflow soldering device, for continuously soldering printed circuit boards in a transport direction (18), comprising a process channel (16) having a pre-heating zone (20), a soldering zone (22) and a cooling zone (24), comprising a base body (60) and a cover which can be displaced between a closed position in which the base body (60) is inserted into the process channel (16), and an open position in which the base body (60) is inserted into the process channel (16), the invention relates to a device for conveying process gas, comprising a base body in which a nozzle plate, a fan unit having a fan motor, an air channel for conveying process gas, a filter element and/or a cooling element are arranged, characterized in that at least one fan unit is arranged in or on the base body laterally adjacent to the process channel in the conveying direction, the air channel is arranged and arranged such that during operation of the at least one fan unit, a