Thermally conductive material and electronic component

The present disclosure addresses the problem of providing a thermally conductive material that can achieve sufficient close contact with a central portion of a heat generating body that generates a large amount of heat, provides improved cooling performance, and has excellent reliability. The heat-c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HATTORI MASAYA, SHIRATO YOJI, KAWAMURA NORIHIRO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure addresses the problem of providing a thermally conductive material that can achieve sufficient close contact with a central portion of a heat generating body that generates a large amount of heat, provides improved cooling performance, and has excellent reliability. The heat-conducting material (1) is provided between the heat-generating body (20) and the heat-dissipating body (30), and is fastened to the heat-generating body (20) and the heat-dissipating body (30) by a plurality of screws. The thermally conductive material (1) is mainly composed of a carbonaceous material and has a plurality of screw holes (13), and a plurality of screws respectively pass through the plurality of screw holes (13) in the thickness direction. Comprising an inner side region which is more toward the central part of the heat conduction material (1) than the plurality of screw holes (13) and an outer side region which is more toward the outer edge part of the heat conduction material (1) than the inner side